3D Integration in VLSI Circuits - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook 3D Integration in VLSI Circuits write by Katsuyuki Sakuma. This book was released on 2018-04-17. 3D Integration in VLSI Circuits available in PDF, EPUB and Kindle. Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
3D Integration for VLSI Systems
3D Integration for VLSI Systems - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook 3D Integration for VLSI Systems write by Chuan Seng Tan. This book was released on 2016-04-19. 3D Integration for VLSI Systems available in PDF, EPUB and Kindle. Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
3D Integration in VLSI Circuits
3D Integration in VLSI Circuits - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook 3D Integration in VLSI Circuits write by Katsuyuki Sakuma. This book was released on 2018-04-17. 3D Integration in VLSI Circuits available in PDF, EPUB and Kindle. Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Handbook of 3D Integration, Volume 1
Handbook of 3D Integration, Volume 1 - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Handbook of 3D Integration, Volume 1 write by Philip Garrou. This book was released on 2011-09-22. Handbook of 3D Integration, Volume 1 available in PDF, EPUB and Kindle. The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Handbook of 3D Integration, Volume 4
Handbook of 3D Integration, Volume 4 - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Handbook of 3D Integration, Volume 4 write by Paul D. Franzon. This book was released on 2019-05-06. Handbook of 3D Integration, Volume 4 available in PDF, EPUB and Kindle. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
