Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging write by . This book was released on 2006. Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging available in PDF, EPUB and Kindle. This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.
Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging
Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging write by . This book was released on 2006. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging available in PDF, EPUB and Kindle.
Power Electronic Packaging
Power Electronic Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Power Electronic Packaging write by Yong Liu. This book was released on 2012-02-15. Power Electronic Packaging available in PDF, EPUB and Kindle. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Solder Joint Reliability Assessment
Solder Joint Reliability Assessment - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Solder Joint Reliability Assessment write by Mohd N. Tamin. This book was released on 2014-04-26. Solder Joint Reliability Assessment available in PDF, EPUB and Kindle. This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging write by Ephraim Suhir. This book was released on 2007-05-26. Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging available in PDF, EPUB and Kindle. This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
