Electronic Packaging Science and Technology

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Release : 2021-12-29
Genre : Science
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Book Rating : 313/5 ( reviews)

Electronic Packaging Science and Technology - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Electronic Packaging Science and Technology write by King-Ning Tu. This book was released on 2021-12-29. Electronic Packaging Science and Technology available in PDF, EPUB and Kindle. Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

Electronic Equipment Packaging Technology

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Release : 2013-11-27
Genre : Science
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Book Rating : 425/5 ( reviews)

Electronic Equipment Packaging Technology - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Electronic Equipment Packaging Technology write by Gerald L. Ginsberg. This book was released on 2013-11-27. Electronic Equipment Packaging Technology available in PDF, EPUB and Kindle. The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.

Mechanical Analysis of Electronic Packaging Systems

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Release : 1999-04-06
Genre : Technology & Engineering
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Book Rating : 334/5 ( reviews)

Mechanical Analysis of Electronic Packaging Systems - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Mechanical Analysis of Electronic Packaging Systems write by Mckeown. This book was released on 1999-04-06. Mechanical Analysis of Electronic Packaging Systems available in PDF, EPUB and Kindle. "Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Electronic Packaging

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Release : 1998
Genre : Electronic packaging
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Book Rating : 354/5 ( reviews)

Electronic Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Electronic Packaging write by John H. Lau. This book was released on 1998. Electronic Packaging available in PDF, EPUB and Kindle. Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Essentials of Electronic Packaging

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Release : 2011
Genre : Technology & Engineering
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Book Rating : 667/5 ( reviews)

Essentials of Electronic Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Essentials of Electronic Packaging write by Puligandla Viswanadham. This book was released on 2011. Essentials of Electronic Packaging available in PDF, EPUB and Kindle. ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.