Electronic Thin-Film Reliability - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Electronic Thin-Film Reliability write by King-Ning Tu. This book was released on 2010-11-25. Electronic Thin-Film Reliability available in PDF, EPUB and Kindle. Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
Electronic Thin-Film Reliability
Electronic Thin-Film Reliability - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Electronic Thin-Film Reliability write by King-Ning Tu. This book was released on 2010-11-25. Electronic Thin-Film Reliability available in PDF, EPUB and Kindle. Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
The Materials Science of Thin Films
The Materials Science of Thin Films - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook The Materials Science of Thin Films write by Milton Ohring. This book was released on 1992. The Materials Science of Thin Films available in PDF, EPUB and Kindle. Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Principles of Vapor Deposition of Thin Films
Principles of Vapor Deposition of Thin Films - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Principles of Vapor Deposition of Thin Films write by Professor K.S. K.S Sree Harsha. This book was released on 2005-12-16. Principles of Vapor Deposition of Thin Films available in PDF, EPUB and Kindle. The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology.Principles of Vapor Deposition of Thin Films brings in to one place a diverse amount of scientific background that is considered essential to become knowledgeable in thin film depostition techniques. Its ultimate goal as a reference is to provide the foundation upon which thin film science and technological innovation are possible.* Offers detailed derivation of important formulae.* Thoroughly covers the basic principles of materials science that are important to any thin film preparation.* Careful attention to terminologies, concepts and definitions, as well as abundance of illustrations offer clear support for the text.
Reliability and Failure of Electronic Materials and Devices
Reliability and Failure of Electronic Materials and Devices - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Reliability and Failure of Electronic Materials and Devices write by Milton Ohring. This book was released on 2014-10-14. Reliability and Failure of Electronic Materials and Devices available in PDF, EPUB and Kindle. Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
