Mechanics of Microelectronics - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Mechanics of Microelectronics write by G.Q. Zhang. This book was released on 2006-08-25. Mechanics of Microelectronics available in PDF, EPUB and Kindle. This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Introductory Quantum Mechanics for Semiconductor Nanotechnology
Introductory Quantum Mechanics for Semiconductor Nanotechnology - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Introductory Quantum Mechanics for Semiconductor Nanotechnology write by Dae Mann Kim. This book was released on 2010-04-26. Introductory Quantum Mechanics for Semiconductor Nanotechnology available in PDF, EPUB and Kindle. The result of the nano education project run by the Korean Nano Technology Initiative, this has been recommended for use as official textbook by the Korean Nanotechnology Research Society. The author is highly experienced in teaching both physics and engineering in academia and industry, and naturally adopts an interdisciplinary approach here. He is short on formulations but long on applications, allowing students to understand the essential workings of quantum mechanics without spending too much time covering the wide realms of physics. He takes care to provide sufficient technical background and motivation for students to pursue further studies of advanced quantum mechanics and stresses the importance of translating quantum insights into useful and tangible innovations and inventions. As such, this is the only work to cover semiconductor nanotechnology from the perspective of introductory quantum mechanics, with applications including mainstream semiconductor technologies as well as (nano)devices, ranging from photodetectors, laser diodes, and solar cells to transistors and Schottky contacts. Problems are also provided to test the reader's understanding and supplementary material available includes working presentation files, solutions and instructors manuals.
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging write by Ephraim Suhir. This book was released on 2007-05-26. Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging available in PDF, EPUB and Kindle. This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Handbook of Lead-Free Solder Technology for Microelectronic Assemblies write by Karl J. Puttlitz. This book was released on 2004-02-27. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies available in PDF, EPUB and Kindle. This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Thermal Stress and Strain in Microelectronics Packaging write by John Lau. This book was released on 2012-12-06. Thermal Stress and Strain in Microelectronics Packaging available in PDF, EPUB and Kindle. Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
