Modeling and Simulation for Microelectronic Packaging Assembly - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Modeling and Simulation for Microelectronic Packaging Assembly write by Shen Liu. This book was released on 2011-05-17. Modeling and Simulation for Microelectronic Packaging Assembly available in PDF, EPUB and Kindle. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Modeling and Simulation for Microelectronic Packaging Assembly
Modeling and Simulation for Microelectronic Packaging Assembly - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Modeling and Simulation for Microelectronic Packaging Assembly write by . This book was released on 2011. Modeling and Simulation for Microelectronic Packaging Assembly available in PDF, EPUB and Kindle.
Modeling and Simulation for Microelectronic Packaging Assembly
Modeling and Simulation for Microelectronic Packaging Assembly - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Modeling and Simulation for Microelectronic Packaging Assembly write by Shen Liu. This book was released on 2011-08-24. Modeling and Simulation for Microelectronic Packaging Assembly available in PDF, EPUB and Kindle. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Modeling and Simulation for Microelectronic Packaging and Integration
Modeling and Simulation for Microelectronic Packaging and Integration - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Modeling and Simulation for Microelectronic Packaging and Integration write by 刘胜. This book was released on 2021. Modeling and Simulation for Microelectronic Packaging and Integration available in PDF, EPUB and Kindle.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Microelectronics Packaging Handbook write by Rao Tummala. This book was released on 1997-01-31. Microelectronics Packaging Handbook available in PDF, EPUB and Kindle. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
