Power Electronic Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Power Electronic Packaging write by Yong Liu. This book was released on 2012-02-15. Power Electronic Packaging available in PDF, EPUB and Kindle. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Reliability of Power Electronic Converter Systems
Reliability of Power Electronic Converter Systems - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Reliability of Power Electronic Converter Systems write by Henry Shu-hung Chung. This book was released on 2015-12-07. Reliability of Power Electronic Converter Systems available in PDF, EPUB and Kindle. The main aims of power electronic converter systems (PECS) are to control, convert, and condition electrical power flow from one form to another through the use of solid state electronics. This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity.
Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Advanced Materials for Thermal Management of Electronic Packaging write by Xingcun Colin Tong. This book was released on 2011-01-05. Advanced Materials for Thermal Management of Electronic Packaging available in PDF, EPUB and Kindle. The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Electronic Packaging Science and Technology
Electronic Packaging Science and Technology - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Electronic Packaging Science and Technology write by King-Ning Tu. This book was released on 2021-12-29. Electronic Packaging Science and Technology available in PDF, EPUB and Kindle. Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Mechanical Analysis of Electronic Packaging Systems
Mechanical Analysis of Electronic Packaging Systems - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Mechanical Analysis of Electronic Packaging Systems write by Mckeown. This book was released on 1999-04-06. Mechanical Analysis of Electronic Packaging Systems available in PDF, EPUB and Kindle. "Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
