Semiconductor Advanced Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Semiconductor Advanced Packaging write by John H. Lau. This book was released on 2021-05-17. Semiconductor Advanced Packaging available in PDF, EPUB and Kindle. The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Advanced Packaging
Advanced Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Advanced Packaging write by . This book was released on 2009-01. Advanced Packaging available in PDF, EPUB and Kindle. Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Materials for Advanced Packaging
Materials for Advanced Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Materials for Advanced Packaging write by Daniel Lu. This book was released on 2016-11-18. Materials for Advanced Packaging available in PDF, EPUB and Kindle. Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Semiconductor Packaging
Semiconductor Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Semiconductor Packaging write by Andrea Chen. This book was released on 2016-04-19. Semiconductor Packaging available in PDF, EPUB and Kindle. In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Microelectronics Packaging Handbook
Microelectronics Packaging Handbook - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Microelectronics Packaging Handbook write by Rao Tummala. This book was released on 1997-01-31. Microelectronics Packaging Handbook available in PDF, EPUB and Kindle. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
