Solder Paste in Electronics Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Solder Paste in Electronics Packaging write by Jennie S. Hwang. This book was released on 2012-12-06. Solder Paste in Electronics Packaging available in PDF, EPUB and Kindle. One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Solder Paste in Electronics Packaging write by Jennie Hwang. This book was released on 2012-12-06. Solder Paste in Electronics Packaging available in PDF, EPUB and Kindle. One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Solder Paste in Electronics Packaging write by Jennie Hwang. This book was released on 1992-09-24. Solder Paste in Electronics Packaging available in PDF, EPUB and Kindle.
Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Solder Paste in Electronics Packaging write by Jennie S Hwang. This book was released on 1989-04-27. Solder Paste in Electronics Packaging available in PDF, EPUB and Kindle.
The Electronic Packaging Handbook
The Electronic Packaging Handbook - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook The Electronic Packaging Handbook write by Glenn R. Blackwell. This book was released on 2017-12-19. The Electronic Packaging Handbook available in PDF, EPUB and Kindle. The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
