Three Dimensional System Integration - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Three Dimensional System Integration write by Antonis Papanikolaou. This book was released on 2010-12-07. Three Dimensional System Integration available in PDF, EPUB and Kindle. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
3D Integration for VLSI Systems
3D Integration for VLSI Systems - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook 3D Integration for VLSI Systems write by Chuan Seng Tan. This book was released on 2016-04-19. 3D Integration for VLSI Systems available in PDF, EPUB and Kindle. Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
3D Integration in VLSI Circuits
3D Integration in VLSI Circuits - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook 3D Integration in VLSI Circuits write by Katsuyuki Sakuma. This book was released on 2018-04-17. 3D Integration in VLSI Circuits available in PDF, EPUB and Kindle. Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
3D Integration for NoC-based SoC Architectures
3D Integration for NoC-based SoC Architectures - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook 3D Integration for NoC-based SoC Architectures write by Abbas Sheibanyrad. This book was released on 2010-11-08. 3D Integration for NoC-based SoC Architectures available in PDF, EPUB and Kindle. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology - read free eBook in online reader or directly download on the web page. Select files or add your book in reader. Download and read online ebook Wafer Level 3-D ICs Process Technology write by Chuan Seng Tan. This book was released on 2009-06-29. Wafer Level 3-D ICs Process Technology available in PDF, EPUB and Kindle. This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
